Heterogeneous Integration for Connectivity and Sustainability

Digital, Industry & SpaceHORIZON-JU-IAID: 101097296
EC Contribution
โ‚ฌ245,738
Consortium Size
67 orgs
Start Year
2023
โ–ถSummary

The challenges and major HiCONNECTS objectives are to transform the centralized cloud platform to decentralized platforms which include edge cloud computing in a sustainable, energy-efficient way. This will bring cloud services including Artificial Intelligence (AI) closer to the IOT end-users, which enables them to really use the COT and IOT efficiently. The technologies underpinning this revolutionary step include the development of high-performance computing, storage infrastructure, network interfaces and connecting media , and the analysis of IOT sensors and big data in real-time. This major step forward will enable, for example, the mobile clients (during the 5G deployment phase and 6G exploration) to move among different places with minimum cost, short response time and with stable connection between cloud nodes and mobile devices.The main underlying technology to be developed by the HiCONNECTS consortium, comprising large industrial players, universities and RTOโ€™s, and many SMEs, can be summarized under the title: โ€™heterogenous integrationโ€™ (HI) which is needed to meet the computing power, bandwidth, latency and sensing requirements for the next generation cloud and edge computing and applications. The HI revolution brings the electronic components and systems (ECS) into a new domain, which combines traditional silicon wafers integrated circuit (IC), InP based high speed electronics , and Si and InP photonics devices and interconnect.The HiCONNECTS ambition is to demonstrate, through HI development, a leap in computing and networking reliability and performances across the full vertical and horizontal ECS value chain (i.e. essential capabilities and key applications) in a sustainable way. In addition, HiCONNECTS will focus on the development of next generation design, algorithms, equipment (HW/SW), systems and Systems of Systems (SOS).

Consortium (67)

๐Ÿ‡ฉ๐Ÿ‡ช NXP SEMICONDUCTORS GERMANY GMBHDE
coordinator
๐Ÿ‡ซ๐Ÿ‡ท 3DIS TECHNOLOGIESFR
partner
๐Ÿ‡ฎ๐Ÿ‡น ACTIVE TECHNOLOGIES SRLIT
partner
๐Ÿ‡ฉ๐Ÿ‡ช AIXTRON SEDE
partner
๐Ÿ‡ฎ๐Ÿ‡ฑ APPLIED MATERIALS ISRAEL LTDIL
partner
๐Ÿ‡ฉ๐Ÿ‡ช ASM AMICRA MICROTECHNOLOGIES GMBHDE
partner
๐Ÿ‡ฆ๐Ÿ‡น AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFTAT
partner
๐Ÿ‡น๐Ÿ‡ท AVL ARASTIRMA VE MUHENDISLIK SANAYI VE TICARET LIMITED SIRKETITR
partner
๐Ÿ‡ฉ๐Ÿ‡ช BARKHAUSEN INSTITUT GGMBHDE
partner
๐Ÿ‡ฆ๐Ÿ‡น BESI AUSTRIA GMBHAT
partner
๐Ÿ‡ณ๐Ÿ‡ฑ BESI NETHERLANDS BVNL
partner
๐Ÿ‡ฎ๐Ÿ‡ฑ BRILLIANETOR LTDIL
partner
๐Ÿ‡ฎ๐Ÿ‡ฑ BRUKER TECHNOLOGIES LTDIL
partner
๐Ÿ‡ซ๐Ÿ‡ฎ CENTRIA-AMMATTIKORKEAKOULU OYFI
partner
๐Ÿ‡ฌ๐Ÿ‡ท CHAROKOPEIO PANEPISTIMIOGR
partner
๐Ÿ‡ฎ๐Ÿ‡ฑ CORETIGO LTDIL
partner
๐Ÿ‡จ๐Ÿ‡ญ CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE SA - RECHERCHE ET DEVELOPPEMENTCH
partner
๐Ÿ‡ฉ๐Ÿ‡ช DEEPXSCAN GMBHDE
partner
๐Ÿ‡ฆ๐Ÿ‡น EV GROUP E. THALLNER GMBHAT
partner
๐Ÿ‡จ๐Ÿ‡ญ EVATEC AGCH
partner
๐Ÿ‡จ๐Ÿ‡ญ Exaddon AGCH
partner
๐Ÿ‡ธ๐Ÿ‡ช EXCILLUM ABSE
partner
๐Ÿ‡ณ๐Ÿ‡ฑ FEI ELECTRON OPTICS BVNL
partner
๐Ÿ‡ฉ๐Ÿ‡ช FERDINAND-BRAUN-INSTITUT GGMBH LEIBNIZ- INSTITUT FUR HOCHSTFREQUENZTECHNIKDE
partner
๐Ÿ‡น๐Ÿ‡ท FORD OTOMOTIV SANAYI ANONIM SIRKETITR
partner
๐Ÿ‡ฉ๐Ÿ‡ช FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG EVDE
partner
๐Ÿ‡ฎ๐Ÿ‡น HORSA S.P.A.IT
partner
๐Ÿ‡ฉ๐Ÿ‡ช HUBER DIFFRAKTIONSTECHNIK GMBH & CO KGDE
partner
๐Ÿ‡ง๐Ÿ‡ช ICOS VISION SYSTEMS NVBE
partner
๐Ÿ‡ฌ๐Ÿ‡ท INFORMATION TECHNOLOGY FOR MARKET LEADERSHIPGR
partner
๐Ÿ‡ฉ๐Ÿ‡ช INNOLUME GMBHDE
partner
๐Ÿ‡ซ๐Ÿ‡ท INSTITUT MINES-TELECOMFR
partner
๐Ÿ‡ง๐Ÿ‡ช INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUMBE
partner
๐Ÿ‡ฎ๐Ÿ‡ฑ KLA-TENCOR CORPORATION (ISRAEL)IL
partner
๐Ÿ‡ณ๐Ÿ‡ฑ LAM RESEARCH INTERNATIONAL BVNL
partner
๐Ÿ‡ฎ๐Ÿ‡ฑ MELLANOX TECHNOLOGIES LTD - MLNXIL
partner
๐Ÿ‡ฎ๐Ÿ‡ฑ NANOMOTION LTDIL
partner
๐Ÿ‡ณ๐Ÿ‡ฑ NEARFIELD INSTRUMENTS B.V.NL
partner
๐Ÿ‡ณ๐Ÿ‡ฑ NEDERLANDSE ORGANISATIE VOOR TOEGEPAST NATUURWETENSCHAPPELIJK ONDERZOEK TNONL
partner
๐Ÿ‡ฎ๐Ÿ‡ฑ NOVA LTDIL
partner
๐Ÿ‡ซ๐Ÿ‡ท NovAliXFR
partner
๐Ÿ‡ซ๐Ÿ‡ท NXP SEMICONDUCTORS FRANCEFR
partner
๐Ÿ‡ณ๐Ÿ‡ฑ NXP SEMICONDUCTORS NETHERLANDS BVNL
partner
๐Ÿ‡ฎ๐Ÿ‡ฑ ORBOTECH LTDIL
partner
๐Ÿ‡ซ๐Ÿ‡ฎ OY ARBONAUT LTDFI
partner
๐Ÿ‡ณ๐Ÿ‡ฑ PHIX BVNL
partner
๐Ÿ‡ฎ๐Ÿ‡ฑ PHONONICS LTDIL
partner
POLITECNICO DI MILANO
partner
๐Ÿ‡ฎ๐Ÿ‡น POLITECNICO DI TORINOIT
partner
๐Ÿ‡ฉ๐Ÿ‡ฐ QTECHNOLOGY A/SDK
partner
๐Ÿ‡น๐Ÿ‡ท RAKUN MOBILITE TEKNOLOJI VE TICARET ANONIM SIRKETITR
partner
๐Ÿ‡น๐Ÿ‡ท SANLAB SIMULASYON ARASTIRMA GELISTIRME SANAYI TICARET ANONIM SIRKETITR
partner
๐Ÿ‡ซ๐Ÿ‡ฎ SAVOX COMMUNICATIONS OY AB LTDFI
partner
๐Ÿ‡ฉ๐Ÿ‡ช SEMI EUROPE GMBHDE
partner
๐Ÿ‡ญ๐Ÿ‡บ SEMILAB FELVEZETO FIZIKAI LABORATORIUM ZARTKORUEN MUKODO RESZVENYTARSASAGHU
partner
๐Ÿ‡ซ๐Ÿ‡ท SIEMENS ELECTRONIC DESIGN AUTOMATION SARLFR
partner
๐Ÿ‡ฎ๐Ÿ‡ฑ SKILL REAL LTDIL
partner
๐Ÿ‡น๐Ÿ‡ท SMART KONTROL SISTEMLERI VE YAZILIM ANONIM SIRKETITR
partner
๐Ÿ‡ซ๐Ÿ‡ฎ SOFTABILITY OYFI
partner
๐Ÿ‡ฎ๐Ÿ‡น STMICROELECTRONICS SRLIT
partner
๐Ÿ‡ณ๐Ÿ‡ฑ TECHNISCHE UNIVERSITEIT EINDHOVENNL
partner
๐Ÿ‡ฎ๐Ÿ‡ฑ TERAMOUNT LTDIL
partner
๐Ÿ‡น๐Ÿ‡ท TURKCELL TEKNOLOJI ARASTIRMA VE GELISTIRME ANONIM SIRKETITR
partner
๐Ÿ‡น๐Ÿ‡ท TURKIYE BILIMSEL VE TEKNOLOJIK ARASTIRMA KURUMUTR
partner
๐Ÿ‡น๐Ÿ‡ท ULAK HABERLESME ASTR
partner
๐Ÿ‡ฎ๐Ÿ‡น UNIVERSITA DEGLI STUDI DI CATANIAIT
partner
๐Ÿ‡ท๐Ÿ‡ด UNIVERSITATEA NATIONALA DE STIINTASI TEHNOLOGIE POLITEHNICA BUCURESTIRO
partner